Advised by ECE Professor Emmanouil M. (Manos) Tenzeris, Mr. Cook is designing and characterizing a multi-layer printing process, which fills a crucial gap in inkjet printing as an industrial electronics fabrication technology. The final process will demonstrate multi-layer, millimeter-wave systems up to 110 GHz on a chip for antennas in inter/intra-chip communication topologies and nanotechnology-enabled autonomous sensor networks.
Potential applications for this work include autonomous sensor nodes, sideband inter/intra-chip communication, energy harvesters, storage devices, and wireless power transfer systems–all of which can be rapidly printed onto nearly any substrate outside of a cleanroom environment. Mr. Cook’s work in this area has been accepted for publication in Electronic Materials Letters and was presented at the 2013 IEEE International Microwave Symposium, which took place June 2-7 in Seattle, Wash.
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